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Sputtering nickel vanadium alloy target used in integrated circuit device
Standard in brief
Scope of Application：
本标准规定了集成电路器件用镍钒合金溅射靶材的要求、试验方法、检验规则和标志、包装、运输、贮存、质量证明书及合同或订货单内容。
本标准适用于电子薄膜制造用的各类镍钒合金溅射靶材。
Basic information
Standard No：YS/T 936-2013
Standard Name：集成电路器件用镍钒合金靶材
English Name：Sputtering nickel vanadium alloy target used in integrated circuit device
Standard Status：现行
Release Date：2013-10-17
Effective Date：2014-03-01
Language of Publication：中文简体
Standard Classification
ICS Number：77.150.40
CCS Number：H62
Related Standards
Referenced Standards：GB/T 1031,GB/T 6394,GB/T 14265,GJB 1580A,YS/T 837
Publication Information
Number of pages：20
Number of words：28 K
Format：大16
Edition：1
Color Pages：0
Electronic Version：Yes
Color Images：No
Print Publication Date：2014-02-01
Standard Revision Information
Has Amendment：No
Other Information
Application Dept：中华人民共和国工业和信息化部
Standard Type：QT
Standard Attribute：YS
Other Standard Number：936
Drafter：董亭义、何金江、刘红宾、张涛、姚力军、王学泽、向磊、徐学礼、朱晓光、丁照崇、吕超、雷继峰、熊晓东、张殿凯、李娜
Drafting Organization：有研亿金新材料股份有限公司
Management Organization：全国有色金属标准化技术委员(SAC/TC 243)
