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Itegrated circuit (IC) card packaging framework
Standard in brief
Scope of Application:
本标准规定了集成电路(IC)卡封装框架(以下简称IC卡封装框架)的技术要求、检验方法、检验规则、包装、贮存和运输。
本标准适用于IC卡封装框架,包括接触式IC卡封装框架和非接触式IC卡封装框架。
Basic information
Standard No:GB/T 39842-2021
Standard Name:集成电路(IC)卡封装框架
English Name:Itegrated circuit (IC) card packaging framework
Standard Status:现行
Release Date:2021-03-09
Effective Date:2021-07-01
Language of Publication:中文简体
Standard Classification
ICS Number:31.200
CCS Number:L56
Related Standards
Referenced Standards:GB/T 2423.2,GB/T 2423.17,GB/T 2423.50,GB/T 2423.51-2020,GB/T 2828.1,GB/T 3922,GB/T 13557,GB/T 16545-2015,GB/T 16649.2,GB/T 16921-2005,GB/T 17554.1,GB/T 25933-2010,GB/T 25934-2010(所有部分),GB/T 32642-2016
Publication Information
Number of pages:24
Number of words:36 K
Format:大16
Edition:1
Color Pages:0
Electronic Version:Yes
Color Images:No
Print Publication Date:2021-03-01
Standard Revision Information
Has Amendment:No
Other Information
Application Dept:国家市场监督管理总局、国家标准化管理委员会
Standard Type:CN
Standard Attribute:GB
Other Standard Number:39842
Drafter:朱林、邵汉文、王广南、陈铎
Drafting Organization:山东新恒汇电子科技有限公司
Management Organization:全国半导体器件标准化技术委员会(SAC/TC 78)
Proposing Department:中华人民共和国工业和信息化部