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Chinese Standard: GB/T 14140-2009

Test method for measuring diameter of semiconductor wafer

全国半导体设备和材料标准化技术委员会材料分技术委员会

本标准规定了用光学投影仪测量硅片直径的方法。本标准适用于测量圆形硅片的直径,可测最大直径为300 mm。本标准不适用于测量硅片的不圆度。

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