$10
Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
全国半导体器件标准化技术委员会(SAC/TC 78)
本标准规定了半导体集成电路塑料双列封装冲制型引线框架(以下简称引线框架)的技术要求及检验规则。
本标准适用于双列(DIP)冲制型引线框架。单列冲制型引线框架亦可参照使用。
This standard is the original Chinese electronic standard.
If you need translation, please contact email: ChineseStandardsLibraryS001@gmail.com.
After you successfully purchase, we will send the electronic version of this standard to your email address