Mechanical standardization of semiconductor devices—Part 4:Coding system and classification into forms of package outlines for semiconductor device packages
IDT IEC 60191-4:2013
全国半导体器件标准化技术委员会(SAC/TC 78)
GB/T 15879的本部分规定了半导体器件的封装外形分类和命名方法，以及为半导体器件封装生成通用描述性命名的系统方法。
本描述性命名方法提供了一种有用的交流工具，但并不确保相同编码的封装具有互换性。
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