Mechanical standardization of semiconductor devices—Part 5:Recommendations applying to tape automated bonding(TAB)of integrated circuits
IDT IEC 60191-5:1997
全国半导体器件标准化技术委员会(SAC/TC 78)
《半导体器件的机械标准化》的本部分规定了采用载带自动焊（TAB）作为结构和互连主要构成的集成电路封装推荐值。
本部分适用于制造厂供给用户的成品单元，对集成电路（IC）到载带的互连（内引线焊接）没有明确要求。
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