Environmental testing for electric and electronic products—Part 2:Test methods—Test Ta:Solderability test by the wetting balance method
IDT IEC 60068-2-54:2006
全国电工电子产品环境技术标准化委员会(SAC/TC 8)
GB/T 2423的本部分适用于确定元器件任何形状的引出端锡焊的可焊性，特别适用于仲裁试验和不能用其他方法做定量试验的元器件引出端锡焊的可焊性评定。对于表面贴装设备，如果合适应选用IEC 60068-2-69。
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