Electromagnetic interference shielding film—Electroless copper plating solution—Method of determining concentration of Ni2+ and Cu2+
全国光学功能薄膜材料标准化技术委员会(SAC/TC 431)
本标准规定了电磁屏蔽膜用化学镀铜溶液中镍离子和铜离子含量的测定方法。
本标准适用于电磁屏蔽膜用化学镀铜溶液中镍离子和铜离子含量的测试。测定范围:化学镀铜溶液中镍离子浓度以NiSO4·6H2O计为0.20 g/L～2.00 g/L;化学镀铜溶液中铜离子浓度以CuSO4·5H2O计为5.0 g/L~60.0 g/L。
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