Chinese Standard: GB/T 28276-2012

Silicon-based MEMS fabrication technology—Specification for dissolved wafer process

全国微机电技术标准化技术委员会(SAC/TC 336)

本标准规定了采用体硅溶片加工工艺进行MEMS器件加工时应遵循的工艺要求和工艺评价规范。
 本标准适用于体硅溶片工艺的加工和质量检验。

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