Silicon-based MEMS fabrication technology—Measurement method of cutting and pull-press strength of micro bonding area
全国微机电技术标准化技术委员会(SAC/TC 336)
本标准规定了硅基MEMS加工过程中所涉及的微小键合区域键合强度检测的要求和试验方法。
本标准适用于采用微电子工艺及相关微细加工技术制造的微小键合区的剪切和拉压强度测试。
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