$10
Test methods for copper foil used for printed boards
全国半导体设备和材料标准化技术委员(SAC/TC 203)
本标准规定了印制板用铜箔外观、尺寸、物理性能、工艺性能及其他性能的试验方法。
本标准适用于刚性及挠性印制板用铜箔。
This standard is the original Chinese electronic standard.
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