Chinese Standard: GB/T 31469-2015

Semiconductor materials cutting fluid

全国半导体设备和材料标准化技术委员会(SAC/TC 203)

本标准规定了半导体材料切削液的各项技术要求、试验方法、检验规则、标志、包装、储存及运输等要求。

本标准适用于半导体材料线切割加工采用的切削液。

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