Chinese Standard: GB/T 31988-2015

Aluminium base copper clad laminate for printed circuits

全国半导体设备和材料标准化技术委员会(SAC/TC 203)

本标准规定了印制电路用铝基覆铜箔层压板的产品分类、标识、结构和材料、外观、尺寸及性能要求、试验方法、检验规则、包装、标志、运输及贮存。

本标准适用于印制电路用铝基覆铜箔层压板（以下简称铝基覆铜板）。

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