Chinese Standard: GB/T 35005-2018

Test methods for flip chip integrated circuits

全国半导体器件标准化技术委员会(SAC/TC 78)

本标准规定了倒装焊集成电路封装工艺中凸点共面性、凸点剪切力、芯片剪切拉脱力、焊点缺陷、底部填充缺陷等方面相关的物理试验方法。

本标准适用于陶瓷封装或塑料封装的倒装焊单片集成电路。

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