Detection method of degree of sphericity of spherical silica for electronic packaging—Particle dynamic photoelectric projection method
全国半导体设备和材料标准化技术委员会(SAC/TC 203)
本标准规定了电子封装用球形二氧化硅微粉颗粒球形度、平均球形度及球形度分布的颗粒动态光电投影测试方法。
本标准适用于4 μm~300 μm的电子封装用球形二氧化硅微粉球形颗粒。
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