Transient thermal test method for light emitting diode modules
中华人民共和国工业和信息化部
本标准规定了由单个、多个发光二极管(LED)芯片或器件组成的LED模块热特性瞬态测试方法原理、一般要求、测试步骤、结果分析及计算、测试报告。本标准适用于单个、多个LED芯片或器件封装而成的模块，以及LED芯片或器件和其他微电子器件构成的模块热特性测量。其他多芯片或器件封装而成的模块热特性测量也可参考。
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