Semiconductor devices—Mechanical and climatic test methods—Part 20:Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IDT IEC 60749-20:2008
全国半导体器件标准化技术委员会(SAC/TC 78)
GB/T 4937的本部分规定了塑封表面安装半导体器件(SMD)的耐焊接热评价方法。该试验为破坏性试验。
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