Chinese Standard: GB/T 4937.22-2018

Semiconductor devices—Mechanical and climatic test methods—Part 22:Bond strength

IDT  IEC 60749-22:2002

全国半导体器件标准化技术委员会(SAC/TC 78)

GB/T 4937的本部分适用于半导体器件（分立器件和集成电路）。
本部分的目的是测量键合强度或确定键合强度是否满足规定的要求。

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