Semiconductor devices—Mechanical and climatic tests methods—Part 3:External visual examination
IDT IEC 60749-3:2002
全国半导体器件标准化技术委员会(SAC/TC 78)
GB/T 4937的本部分的目的是验证半导体器件的材料、设计、结构、标志和工艺质量是否符合适用的采购文件的要求。外部目检是非破坏性试验，适用于所有的封装类型。
本试验用于鉴定检验、过程监控、批接收。
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