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Chinese Standard: GB/T 8750-2014

Gold bonding wire for semiconductor package

全国有色金属标准化技术委员会

本标准规定了半导体分立器件、集成电路、LED封装用键合金丝(以下简称金丝)的要求、试验方法、检验规则、标志、包装、运输和贮存、质量证明书、合同(或订货单)等内容。
本标准适用于半导体封装用键合金丝。

This standard is the original Chinese electronic standard.
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