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Microbeam analysis—Transmission electron microscopy—Method for measuring the thickness of functional thin films in integrated circuit chips
Standard in brief
Scope of Application：
本文件规定了用透射电子显微镜/扫描透射电子显微镜(TEM/STEM)测定集成电路芯片中功能薄膜层厚度的方法。本文件适用于测定几个纳米以上厚度的集成电路芯片中功能薄膜层。
Basic information
Standard No：GB/T 43748-2024
Standard Name：微束分析 透射电子显微术 集成电路芯片中功能薄膜层厚度的测定方法
English Name：Microbeam analysis—Transmission electron microscopy—Method for measuring the thickness of functional thin films in integrated circuit chips
Standard Status：现行
Release Date：2024-03-15
Effective Date：2024-10-01
Language of Publication：中文简体
Standard Classification
ICS Number：71.040.50
CCS Number：N33
Related Standards
Referenced Standards：GB/T 8170,GB/T 18907-2013,GB/T 20724-2021,GB/T 30544.4,GB/T 40300-2021,JY/T 0583-2020
Publication Information
Number of pages：16
Number of words：21 K
Format：大16
Edition：1
Color Pages：0
Electronic Version：Yes
Color Images：Yes
Print Publication Date：2024-03-01
Standard Revision Information
Has Amendment：No
Other Information
Application Dept：国家市场监督管理总局、国家标准化管理委员会
Standard Type：CN
Standard Attribute：GB
Other Standard Number：43748
Drafter：伍超群、于洪宇、乔明胜、陈文龙、周鹏、邱杨、黄晋华、汪青、程鑫
Drafting Organization：广东省科学院工业分析检测中心、南方科技大学、胜科纳米(苏州)股份有限公司
Management Organization：全国微束分析标准化技术委员会(SAC/TC 38)
Proposing Department：全国微束分析标准化技术委员会(SAC/TC 38)
